H2S
Engineering-gradeA different tier entirely. 1000 mm/s, 350°C hotend, 65°C actively heated chamber, and a build volume that finally gives you real room. The H2S is Bambu's first machine built for serious engineering materials work.
Should I buy the H2S?
Yes, if you need to print PA-CF, PC, or other high-temp engineering materials: the 350°C hotend and active 65°C chamber are the only way to do it reliably in Bambu's lineup. For PLA/PETG/ABS only, the P2S at $549 is a better fit.
| Motion & Print | |
|---|---|
| Build volume | 340 × 320 × 340 mm |
| Max speed | 1000 mm/s |
| Acceleration | 20,000 mm/s² |
| Motion system | CoreXY (H-series) |
| Layer resolution | 0.05–0.35 mm |
| Extruder | Direct drive (high-temp) |
| Nozzle (stock) | 0.4mm hardened steel |
| Temperature & Enclosure | |
|---|---|
| Nozzle max | 350°C |
| Bed max | 120°C |
| Enclosure | Yes, fully sealed |
| Chamber heating | Active, up to 65°C |
| Chamber heat time | ~25 min to 65°C |
| HEPA filter | Yes |
| Carbon filter | Yes |
| Bed surface | PEI (magnetic, high-temp) |
| Auto leveling | Yes |
| Vibration comp. | Yes (accelerometer) |
| Flow calibration | Yes (automatic) |
| Camera | Yes (included) |
| AMS | AMS 2.0 compatible (up to 16 colors) |
| Dual nozzle | No (single, see H2D) |
| Connectivity | Wi-Fi 2.4GHz, LAN, Ethernet |
| Machine dimensions | ~480 × 440 × 580 mm |
| Weight | ~32 kg |
| Power supply | 100–240V AC, 1500W |
| Status | Current (Aug 2025) |
The H2S is a fundamentally different machine from everything else in Bambu's lineup. The combination of 350°C hotend, 65°C actively heated chamber, and 1000 mm/s print speed opens up materials that were simply not viable on the A/P/X series: PA-CF, high-temp PA grades, PC blends, and other engineering polymers that need both high extrusion temperatures and sustained chamber temperatures.
At $1,249, it's priced just $50 above the X1 Carbon. For that $50 more: faster print speeds, higher-temperature hotend, active heated chamber, and a larger build volume. The X1C retains Lidar quality sensing, that's the only scenario where you'd choose it over the H2S. The H2S is heavy (32 kg), consumes 1500W, and takes 25 minutes to pre-heat. For PLA and PETG it's overkill, but for engineering parts it's the right tool.
Pros
- 350°C hotend: prints PC, PA-CF, high-temp materials
- 65°C active heated chamber: reliable engineering prints
- 1000 mm/s: fastest in the Bambu lineup
- 340×320×340 mm: large, useful build volume
- Ethernet connectivity option
- Hardened steel nozzle stock
- AMS 2.0 compatible
- HEPA + carbon filtration
Cons
- Heavy at 32 kg, not portable
- 1500W power draw, check your circuit
- Chamber takes ~25 min to pre-heat
- No Lidar (X1C has this)
- No dual nozzle (H2D has this)
- Overkill for PLA/PETG printing
- AMS 2.0 sold separately
| Material | Support | Notes |
|---|---|---|
| PLA / PLA+ | Works | Open the door partially for cooling. Overkill but functional. |
| PETG | Works | Fine, but the H2S is not the machine for PETG day-to-day. |
| ABS / ASA | Excellent | The active chamber makes these even more reliable than on P2S. |
| PA-CF (PA12-CF, PA6-CF) | Excellent | This is what the H2S is designed for. Reliable with 65°C chamber. |
| PC (Polycarbonate) | Supported | 350°C hotend + active chamber makes PC viable. Dry filament required. |
| PC-CF / PC-ABS | Supported | Hardened nozzle stock helps. Good results. |
| PA6-GF / PA12-GF | Excellent | Glass-filled nylons work well here. |
| TPU | Supported | Works. Use low chamber temp for flexible materials. |
| PEEK / PEI / ULTEM | Marginal | 350°C is on the low end for PEEK. Some grades work; check manufacturer specs. |
Pre-heat protocol: For engineering materials, set chamber target to 65°C and wait ~25 minutes before starting the print. Let the temperature stabilize for 5 minutes. Parts printed with a pre-heated chamber have consistently better adhesion.
Dry filament: PA-CF and PC are hygroscopic. Always dry filament before printing (80°C for 6+ hours). Moisture causes popping, stringing, and poor layer adhesion, even the best chamber won't fix wet filament.
Power: The H2S draws 1500W. Verify your circuit can handle this, especially if other equipment is on the same breaker.
Ethernet: The H2S supports wired Ethernet in addition to Wi-Fi, useful in workshop environments with poor Wi-Fi coverage.
H2S or X1C? H2S for nearly everything: faster, larger, higher temp, active chamber, for $50 more. X1C only if Lidar quality sensing is specifically what you need.
H2S or H2D? H2S if single-material engineering parts or multi-colour via AMS is sufficient. H2D if you need simultaneous dual-material printing (soluble supports, dual-material parts) or the optional laser module.
H2S or P2S? P2S ($549) if your materials stop at ABS/ASA. H2S ($1,249) if you need PC, PA-CF, or the larger build volume.
Is 1000 mm/s usable? The rated maximum; real-world quality printing is around 400–600 mm/s. But the faster acceleration profile does meaningfully reduce print times on complex models compared to the P-series.