The P2S and X2D share the same CoreXY architecture, same 300°C nozzle, same bed temperature, same enclosure approach. The $100 price gap buys you three meaningful upgrades on the X2D: active chamber heating, dual nozzle capability, and 25-color AMS 2.0.
Active chamber heating is the biggest. The P2S passively warms to ~50°C through print heat, which is fine for ABS in a warm room but unreliable in cold environments. The X2D actively holds 65°C regardless of ambient temperature, making it significantly more consistent for ABS, ASA, and materials that warp without a stable chamber environment.
The P2S is rated at 600 mm/s vs the X2D's 500 mm/s. In real-world quality printing this matters less than you'd think: most quality profiles run at 200–300 mm/s regardless. For draft/speed printing modes however, the P2S will finish jobs noticeably faster.
If your use case is high-volume PLA production where speed is the primary metric, the P2S wins. For everything else, the X2D's feature set is more useful.
Yes, in the right conditions. In a warm workshop (18°C+) with a draft-free environment, the P2S passively reaches ~50°C which handles ABS reliably for most parts. Where it struggles is in cold garages, air-conditioned rooms, or large parts that take 8+ hours and experience temperature swings. The X2D's active 65°C chamber eliminates these environmental variables entirely, which is the core reason to choose it over the P2S for engineering materials.